F-17
TopoLogic Inc.
- Business Overview
- We leverage topological materials, which gained attention through the Nobel Prize in Physics, to address social challenges that have been difficult to solve with conventional materials technologies. Our next-generation semiconductor memory under development, “TL-RAM,” is a technology that can increase the amount of memory integrated within processors by a factor of 10, significantly improving processing performance particularly in GPUs for advanced AI training and SoCs for edge AI. In addition, our heat flux sensor under validation, “TL-SENSING,” enables the detection of early signs of battery thermal runaway, which conventional temperature sensors have been unable to detect, thereby helping ensure the safety of energy storage technologies that form a fundamental part of social infrastructure. For “TL-RAM,” we are already exchanging technical information and taking other steps toward collaboration with major overseas foundries. For “TL-SENSING,” in addition to battery anomaly detection, proof-of-concept testing is underway with multiple major Japanese manufacturers for adoption across a wide range of applications, including deep body temperature measurement.
- Exhibition Contents
We will exhibit a 4-inch wafer of the next-generation semiconductor memory “TL-RAM” and a demo unit of the heat flux sensor “TL-SENSING.”
- Corporate Website
- https://www.topologic.jp/en